基于搅拌摩擦焊接的完全热力耦合模型,跟踪材料物质点运动轨迹,划分出不同搅拌头转速下搅拌区域边界.沿材料物质点迹线提取出真实应变与温度历程,可进一步计算Zener-Hollomon参数并利用经验公式预测搅拌区晶粒尺寸.经计算发现较大转速工况下,搅拌区尺寸较大.搅拌区晶粒尺寸随焊接温度的增加而增加,随应变率的增加而减小.随着搅拌头转速的增加,焊接区材料温度与等效应变率均有明显增长,但是温度影响更为明显,平均晶粒尺寸随搅拌头转速的增加而增加.
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