欢迎登录材料期刊网

材料期刊网

高级检索

采用液相化学还原法制备出平均粒径为20~35nm的纳米银,并考察不同温度及PVP用量对纳米银性质的影响.结果表明:当硝酸银与PVP的质量比为1∶4、反应温度为30℃时,纳米银的平均粒径最小,为22.4nm,且其团聚程度最小,粒径分布最佳.在压力10MPa、温度200℃、保温30min的烧结条件下,利用制得的纳米银配制焊膏,连接纯度为99.9%的无氧紫铜板,通过扫描电镜(SEM)观察烧结接头截面形貌,可见烧结界面连接紧密,接头组织有孔隙存在.

参考文献

[1] 邹贵生,闫剑锋,母凤文,吴爱萍,Zhou Y.Norman,白海林,任家烈.微连接和纳连接的研究新进展[J].焊接学报,2011(04):107-112.
[2] 甘贵生,杜长华,甘树德.电子微连接高温无铅钎料的研究进展[J].功能材料,2013(z1):28-35,40.
[3] 朱颖,唐善平,闫剑锋,邹贵生.纳米银膏与微米银膏烧结连接对比[J].北京航空航天大学学报,2013(04):484-487.
[4] Yaowu Shi;Weiping Fang;Zhidong Xia;Yongping Lei;Fu Guo;Xiaoyan Li .Investigation of rare earth-doped BiAg high-temperature solders[J].Journal of Materials Science. Materials in Electronics,2010(9):875-881.
[5] MORISADA Y;NAGAOKA T;FUKUSUMI M A .Low-temperature bonding process using mixed Cu-Ag nanoparticles[J].Journal of Electronic Materials,2010,39(08):1283-1287.
[6] Yusuke Akada;Hiroaki Tatsumi;Takuto Yamaguchi .Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior[J].Materials transactions,2008(7):1537-1545.
[7] A. Hu;J. Y. Guo;H. Alarifi;G. Patane;Y. Zhou;G. Compagnini;C. X. Xu .Low temperature sintering of Ag nanoparticles for flexible electronics packaging[J].Applied physics letters,2010(15):153117-1-153117-3.
[8] E. Ide;S. Angata;A. Hirose .Metal-metal bonding process using Ag metallo-organic nanoparticles[J].Acta materialia,2005(8):2385-2393.
[9] ZOU G S;YAN J F;MU F W.Low temperature bonding of Cu metal through sintering of Ag nanoparticles for high temperature electronic application[J].The Open Surface Science Journal,2011(03):70-75.
[10] YAN J F;ZOU G S;HU A M et al.Preparation of polymer coated CuNPs and its applications for low-temperature bonding[J].Journal of Materials Chemistry,2011,21:15981-15986.
[11] 闫剑锋,邹贵生,李健,吴爱萍.纳米银焊膏的烧结性能及其用于铜连接的研究[J].材料工程,2010(10):5-8.
[12] YAN Jian-feng;ZOU Gui-sheng;WANG Xiao-yu.Largescale synthesis of Ag nanoparticles by polyol process for low temperature bonding application[A].Shanghai:IEEE/IEE Electronic Library(IEL),2011:254-259.
[13] YAN Jian-feng;ZOU Gui-sheng;WU Ai-ping et al.Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packing application[J].Journal of Physics:Conference Series,2012,379:1-6.
[14] 姚宝慧,徐国财,张宏艳,韩笑.PVP催化还原及稳定化纳米银的微波合成[J].无机化学学报,2010(09):1629-1632.
[15] 齐昆 .纳米银焊膏低温烧结粘接可靠性研究[D].天津大学,2007.
[16] 母凤文,邹贵生,赵振宇,吴爱萍,闫久春,Y.Norman Zhou.微米氧化银膏原位生成纳米银的低温烧结连接[J].焊接学报,2013(04):38-42.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%