用分子动力学方法模拟了纳米多晶Cu/Ni薄膜在不同应变率下进行应变加载时的变形行为与力学性能.结果表明:Cu/Ni薄膜在较高的应变率加载情况下具有较高的屈服极限和应变率敏感性(m).应变率为108s1时Cu/Ni多层膜的界面上产生孔洞,而应变率为1010s-1时纳米多晶Cu薄膜出现碎裂.在较高的应变率加载条件下,Cu,Ni薄膜中FCC,HCP,OTHER原子团分数变化都很显著,而较小应变率时只有Cu薄膜的结构变化明显.模拟结果还表明,应变率增加有利于堆垛层错的形成,但应变率超过某一值时无序原子团增加会阻碍堆垛层错原子团的生长.
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