半导体学报（英文版）, 2015, 36(9): 143-148. doi: 10.1088/1674-4926/36/9/096001

基金项目: Project supported by the Special Project Items No.2 in National Long-Term Technology Development Plan,China (No.2009ZX02308) and the Natural Science Foundation of Hebei Province,China (No.F2013202104).

A quantitative investigation of the influence with the components of the CMP alkali slurry on the polishing rate

Keywords： polishing slurry

参考文献

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