参考文献
[1] | lstratov A A,Weber E R.Physics of copper in silicon.J Electrochem Soc,2002,149(1):G21 |
[2] | Weber E R.Transition metals in silicon.Appl Phys A,1983,30:1 |
[3] | Bokhonov B,Korchagin M.In-situ investigation of the formation of nickel silicides during interaction of single-crystalline and amorphous silicon with nickel.Journal of Alloys and Compounds,2001,319:187 |
[4] | Xu J,Yang D R,Moeller H J.Influence of copper precipitation on the formation of denuded zone in Czochralski silicon.J Appl Phys,2007,102:114506 |
[5] | Xu J,Wang Y Z,Yang D R,et al.Influence of nickel precipitation on the formation of denuded zone in Czochralski silicon.Journal of Alloys and Compounds,2010,502:351 |
[6] | Myers S M,Seibt M,Schr(o)ter W.Mechanisms of transition-metal gettering in silicon.J Appl Phys,2000,88(7):3795 |
[7] | Istratov A A,Weber E R.Electrical properties and recombination activity of copper,nickel and cobalt in silicon.Appl Phys A:Mater Sci Processing,1998,66:123 |
[8] | Rizk R,Portier X,Allais G,et al.Electrical and structural studies of copper and nickel precipitates in a Σ =25 silicon bicrystal.J Appl Phys,1994,76:952 |
[9] | Palais O,Yakimov E,Martinuzzi S.Minority carrier lifetime scan maps applied to iron concentration mapping in silicon wafers.Mater Sci Eng B,2002,91:216 |
[10] | Buonassisi T,Heuer M,Istratov A A.Transition metal coprecipitation mechanisms in silicon.Acta Materialia,2007,55:6119 |
[11] | Saring P,Rudolf C,Stolze L,et al.Light-beam-induced current measurements on copper-nickel co-contaminated Cz-silicon bicrystals.Mater Sci Eng B,2009,159/160:216 |
[12] | Falster R,Voronkov V V.The engineering of intrinsic point defects in silicon wafers and crystals.Mater Sci Eng B,2000,73(1-3):87 |
[13] | Tan T Y,Gardner E E,Tice W K.Intrinsic gettering by oxide precipitate induced dislocations in Czochralski Si.Appl Phys Lett,1977,30:175 |
[14] | Xi Z Q,Chen J,Yang D R.Copper precipitation in large-diameter Czochralski silicon.J Appl Phys,2005,97:094909 |
[15] | Rozgonyi G A,Pearce C W.Gettering of surface and bulk impurities in Czochralski silicon wafers.Appl Phys Lett,1978,32(11):747 |
[16] | Yu X G,Ma X Y,Yang D R.Rapid thermal process of large diameter Czochralski silicon.Chinese Journal of Semiconductors,2003,24(5):491 |
[17] | Falster R,Voronkov V V,Quast F.On the Properties of the intrinsic point defects in silicon:a perspective from crystal growth and wafer processing.Phys Status Solidi B,2000,222:219 |
[18] | Pagani M,Falster R J,Fisher G R,et al.Spatial variations in oxygen precipitation in silicon after high temperature rapid thermal annealing.Appl Phys Lett,1997,70:1572 |
[19] | Xi Z Q,Yang D R,Chen J,et al.Investigation of copper precipitation in as-grown Czochralski silicon.Chinese Journal of Semiconductors,2005,26(9):1754 |
[20] | Xi Z Q,Yang D R,Jin X,et al.Effect of intrinsic point defects on copper precipitation in large-diameter Czochralski silicon.Appl Phys Lett,2003,83(15):3048 |
[21] | Shabani M B,Yoshimi T,Okuuchi S,et al.A quantitative method of metal impurities depth profiling for gettering evaluation in silicon wafers.Solid State Phenomena,1997,57:81 |
[22] | Heuer M,Buonassisi T,Marcus M A,et al.Complex intermetallic phase in multicrystalline silicon doped with transition metals.Phys Rev B,2006,73:235204 |
[23] | Istratov A A,Flink C,Hieslmair H,et al.Intrinsic diffusion coefficient of interstitial copper in silicon.Phys Rev Lett,1998,81:1243 |
[24] | McHugo S G,Mohammed A,Thompson A C,et al.Copper precipitates in silicon:precipitation,dissolution,and chemical state.J Appl Phys,2002,91(10):6396 |
[25] | Xi Z Q,Yang D R,Chen J,et al.Nickel precipitation in largediameter Czochralski silicon.Phys B:Condensed Matter,2004,344(1-4):407 |
[26] | T(o)r(o)k P,Mule'stagno L.Applications of scanning optical microscopy in materials science to detect bulk microdefects in semiconductors.Journal of Microscopy,1997,188:1 |
[27] | Booker G R,Laczik Z,Kidd P.The scanning infrared microscopy (SIRM) and its application to bulk GaAs and Si:a review.Semicond Sci Technol,1992,7:A110 |
[28] | Borghesi A,Pivac B,Sassella A,et al.Oxygen precipitation in silicon.J Appl Phys,1995,77:4196 |
[29] | Gay N,Martinuzzi S.External self-gettering of nickel in float zone silicon wafers.Appl Phys Lett,1997,70:2568 |
[30] | Cui C,Yang D R,Ma X Y.Effects of annealing atmosphere on bulk micro-defects in czochralski silicon wafer.Chinese Journal of Semiconductors,2007,28(6):866 |
[31] | Rudolf C,Saring P,Stolze L,et al.Co-precipitation of copper and nickel in crystalline silicon.Mater Sci Eng B,2009,159/160:365 |
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