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The annealing process for boron implantation is a crucial step during large size nuclear radiation detector fabrication. It can reduce the lattice defects and the projection straggling. A two-step annealing process for boron implantation was developed instead of a one-step annealing process, and the reverse body resistance of a silicon micro-strip detector was significantly increased, which means that the performance of the detector was improved.

参考文献

[1] O'Sullivan BJ.;Leveugle C.;Das JH.;Hurley PK. .Si(100)-SiO2 interface properties following rapid thermal processing[J].Journal of Applied Physics,2001(7):3811-3820.
[2] Santucci S.;Passacantando M.;Picozzi P.;Fama F.;Nardi N. Basile F.;Guerrieri S. .Effects of rapid thermal treatments on the electrical properties of thin SiO2 gate oxide for DRAM p-channel MOS transistors[J].Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites,2001(1/3):54-58.
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