采用纯 Al 片表面浸 Zn 后再电镀厚 Cu 层的方法制备 Cu/Al 层状复合材料。在473~673 K 温度范围内对该复合材料进行退火，研究退火过程中 Cu/Al 界面扩散与反应、界面金属间化合物(IMCs)层的长大动力学以及Cu/Al 层状复合材料电阻率。结果表明，经过473 K、360 h 的退火处理，未观察到 Cu?Al IMCs 层，显示 Zn 中间层能有效抑制 Cu/Al 界面扩散。可是，当复合材料经573 K 及以上温度退火时，Zn 层中的 Zn 原子主要向 Cu 中扩散，从 Al 侧到 Cu 侧形成 CuAl2/CuAl/Cu9Al4三层结构的反应产物。IMC 层遵循扩散控制的生长动力学，Cu/Al复合材料的电阻率随退火温度及时间的增加而增大。
Cu/Al laminar composite was prepared by dipping Zn layer and then electroplating Cu thick layer on pure Al sheet. During annealing the Cu/Al composites at temperature from 473 to 673 K, the Cu/Al interfacial diffusion and reaction and its kinetics and also the electrical resistivity of the composites were studied. The results show that no Cu?Al IMC layer is observable as the composites are annealed at 473 K for time till 360 h, indicating that the Zn intermediate layer can effectively suppress the Cu/Al interfacial diffusion. However, as the composites are annealed at 573 K and above, Zn atoms in the Zn layer dissolve into the Cu layer. Tri-layered reaction product of CuAl2/CuAl/Cu9Al4 then forms from the Al side to the Cu side. The IMC layer follows the diffusion-controlled growth kinetics. Electrical resistivity of the Cu/Al composites increases with the increase of the annealing temperature and time.
参考文献
| [1] | TANG Wen-ming;HE An-qiang;LIU Qi;D. G. IVEY.Solid state interfacial reactions in electrodeposited Cu/Sn couples[J].中国有色金属学报（英文版）,2010(01):90-96. |
| [2] | M ZAMANI;A AMADEH;S M LARI BAGHAL.钴含量对电沉积镍-钴合金电沉积机理和力学性能的影响[J].中国有色金属学报（英文版）,2016(2):484-491. |
| [3] | 张海军;孙俭峰.Ni-7Cr-4Al纳米复合镀层的氧化和热腐蚀性能[J].中国有色金属学报（英文版）,2015(1):191-198. |
| [4] | A. HE;Q. LIU;D. G. IVEY.Development of stable, non-cyanide solutions for electroplating Au-Sn alloy films[J].Journal of Materials Science. Materials in Electronics,20061(1):63-70. |
| [5] | Wenming Tang;Anqiang He;Qi Liu.Room temperature interfacial reactions in electrodeposited Au/Sn couples[J].Acta materialia,200819(19):5818-5827. |
| [6] | 张健;陈国宏;王若民;缪春辉;郑治祥;汤文明.碱蚀液浓度对纯铝表面二次浸锌的影响?[J].功能材料,2016(5):5201-5206. |
| [7] | Lysak, V. I.;Kuzmin, S. V..Energy balance during explosive welding[J].Journal of Materials Processing Technology,2015:356-364. |
| [8] | M. Abbasi;A. Karimi Taheri;M.T. Salehi.Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20011/2(1/2):233-241. |
| [9] | Won-Bae Lee;Kuek-Saeng Bang;Seung-Boo Jung.Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20051/2(1/2):212-219. |
| [10] | 张秋征;宫文彪;刘威.铝-铜异种金属搅拌摩擦焊接头组织及力学性能[J].中国有色金属学报（英文版）,2015(6):1779-1786. |
| [11] | Takehiko WATANABE;Misato NAKAMURA;Shizuyo KONUMA.Soldering of aluminum alloy 6063 to copper with ultrasonic vibration[J].軽金属,20036(6):245-250. |
| [12] | M. Kanungo;K. G. Mishra;S. C. Das.Study on morphology of copper deposited onto aluminium by immersion plating from an oxalate bath containing perchloric acid[J].Minerals Engineering,200312(12):1383-1386. |
| [13] | Jae-Ho JANG;Dae-Geun NAM;Yong-Ho PARK;Ik-Min PARK.固溶处理和人工时效对Al-Cu合金显微组织和力学性能的影响[J].中国有色金属学报（英文版）,2013(03):631-635. |
| [14] | H. Xu;C. Liu;V.V. Silberschmidt.Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds[J].Acta materialia,201114(14):5661-5673. |
| [15] | Chih-Yuan Chen;Weng-Sing Hwang.Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints[J].Materials transactions,20077(7):1938-1947. |
| [16] | Braunovic M.;Alexandrov N..Intermetallic compounds at aluminum-to-copper electrical interfaces: effect of temperature and electric current[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,19941(1):78-85. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%