通过热压缩实验研究变形温度和应变速率对纯铜热变形行为的影响，确定了应变硬化率、动态再结晶临界应力、饱和应力、动态回复体积分数和动态再结晶体积分数的表达式。结合热加工图，得到纯铜的失稳区域主要位于400~450°C、0.001~0.05 s?1和450~750°C、0.05~1 s?1区间，稳态区域的变形机制主要为动态再结晶。对流变应力进行预测，预测结果与实验结果吻合较好。
The effects of the deformation temperature and the strain rate on the hot deformation behavior of pure copper were investigated based on compression tests. The expressions of strain hardening rate, dynamic recrystallization critical stress, saturated stress, dynamic recovery volume fraction and dynamic recrystallization volume fraction were determined. According to the processing map, the instability regions occur in regions of 400?450 °C, 0.001?0.05 s?1 and 450?750 °C, 0.05?1 s?1. The deformation mechanism in the stability region is dynamic recrystallization. The flow stress was predicted. The results also show that the true stress–true strain curves predicted by the extracted model are in good agreement with the experimental results.
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