经Sn/Pd活化后，在SiC体积分数为65%的SiCp/Al复合材料表面化学镀Ni?P合金，研究复合材料表面形貌及其对Ni?P沉积过程的影响，以及Ni和P原子间的结合方式。结果表明，Sn/Pd活化点分布不均导致Ni?P颗粒优先沉积在Al合金和粗糙的SiC表面以及腐蚀孔洞中，Ni?P 合金膜具有非晶结构，其中Ni原子和P原子间依靠化学键结合。在形成连续的Ni?P合金膜之后，化学镀Ni?P合金不再受SiCp/Al复合材料表面形貌及特性的影响，而是受化学镀本身控制，Ni?P合金膜遵循线性生长动力学，其活化能为68.44 kJ/mol。
After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bonding action of Ni and P atoms in the Ni?P alloy were studied. The results show that inhomogeneous distribution of the Sn/Pd activating points results in preferential deposition of the Ni?P alloy particles on the Al alloy and rough SiC particle surfaces and in the etched caves. The Ni?P alloy film has an amorphous structure where chemical bonding between Ni and P atoms exists. After a continuous Ni?P alloy film formed, electroless Ni?P alloy plating is not affected by surface morphology and characteristics of the SiCp/Al composite any longer, but by the electroless plating process itself. The Ni?P alloy film follows linear growth kinetics with an activation energy of 68.44 kJ/mol.
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