研究初生α相晶粒尺寸对Ti-6Al-4V合金压力连接界面特征及接头剪切强度的影响.定量试验结果表明,当初生α相晶粒尺寸由8.2 μm增大至16.4 μm时,平均空洞尺寸由0.8μm增大至2.6μm,连接率由90.9％降至77.8％.空洞形状由微小的圆形转变为不规则的条状.初生α相晶粒尺寸为8.2 pm的Ti-6Al-4V合金压力连接接头剪切强度最高.这是因为初生α相晶粒尺寸越小,Ti-6Al-4V合金塑性流动能力越强,短程扩散通道越多,从而促进了空洞闭合和跨连接界面的α/β晶粒的形成.
参考文献
| [1] | Atieh, A.M.;Khan, T.I..Effect of process parameters on semi-solid TLP bonding of Ti-6Al-4V to Mg-AZ31[J].Journal of Materials Science,201319(19):6737-6745. |
| [2] | H. Li;H.B. Liu;W.X. Yu;M.Q. Li.Fabrication of high strength bond of Ti-17 alloy using press bonding under a high bonding pressure[J].Materials Letters,2013Oct.1(Oct.1):212-214. |
| [3] | G. A. Salishchev;R. M. Galeyev;O. R. Valiakhmetov;R. V. Safiullin;R. Y. Lutfullin;O. N. Senkov;F. H. Froes;O. A. Kaibyshev.Development of Ti-6Al-4V sheet with low temperature superplastic properties[J].Journal of Materials Processing Technology,20012/3(2/3):265-268. |
| [4] | Kaibyshev OA;Safiullin RV;Lutfullin RY;Valiakhmetov OR;Galeyev RM;Dutta A;Raghu T;Saha GG.Advanced superplastic forming and diffusion bonding of titanium alloy[J].Materials Science and Technology: MST: A publication of the Institute of Metals,20063(3):343-348. |
| [5] | Larry D. Hefti.Innovations in the Superplastic Forming and Diffusion Bonded Process[J].Journal of Materials Engineering and Performance,20082(2):178-182. |
| [6] | J. M. Gómez de Salazar;A. Urena;J. G. Carrión.Charpy impact test of Ti-6Al-4V joints diffusion welded at low temperature[J].Scripta materialia,19964(4):479-484. |
| [7] | R. K. Rayudu;T. Arunkumar;S. S. Bhattacharya.Experimental Studies on the Superplastic Forming of Square Shaped Components and Diffusion Bonding Characteristics of T1-6A1-4V Alloy[J].Transactions of the Indian Institute of Metals,20134(4):313-323. |
| [8] | 李宏;张超;刘宏彬;李淼泉.Ti-17钛合金扩散连接界面特征及接头剪切强度[J].中国有色金属学报（英文版）,2015(1):80-87. |
| [9] | Rajesh Korla;Atul H. Chokshi.Strain-rate sensitivity and microstructural evolution in a Mg–Al–Zn alloy[J].Scripta materialia,20109(9):913-916. |
| [10] | Kee-Do Woo;Sug-Won Kim;Chang-Ho Yang.Effects of grain size on high temperature deformation behavior of Al-4Mg-0.4Sc alloy[J].Materials Letters,200313/14(13/14):1903-1909. |
| [11] | Ning, Z.L.;Liu, H.H.;Cao, F.Y.;Wang, S.T.;Sun, J.F.;Qian, M..The effect of grain size on the tensile and creep properties of Mg-2.6Nd-0.35Zn-xZr alloys at 250°C[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2013:163-169. |
| [12] | 刘会杰;冯秀丽.TC21钛合金扩散连接接头的微观组织及界面质量[J].中国有色金属学报（英文版）,2011(1):58-64. |
| [13] | M. Martinez;M. Legros;T. Signamarcheix;L Bally;S. Verrun;L.Di Cioccio;C. Deguet.Mechanisms of copper direct bonding observed by in-situ and quantitative transmission electron microscopy[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2013Mar.1(Mar.1):96-99. |
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