在压力29 MPa、不同焊接温度和焊接时间下,采用扩散焊技术连接7075铝合金和AZ31B镁合金.对样品界面进行扫描电镜观察、剪切测试和显微硬度测试来研究焊接温度和焊接时间对可焊性的影响.结果表明:7075铝合金/AZ31B镁合金复合板材被很好地连接在一起,且在焊合区形成金属间化合物如Al12Mg17和Al3Mg2.由于晶粒粗化和脆性化合物的形成,升高焊接温度和延长焊接时间会导致剪切强度降低和界面焊接硬度增加.在450℃焊接120 min得到的扩焊接接头具有最小的剪切强度(15 MPa)和最大的显微硬度(HV 176).提高焊接温度且选择合适的焊接时间能显著地提高焊接界面层厚度.将焊接温度从430℃提高到450℃,焊接时间为120 min时,焊接界面层厚度增加了26％,而当焊接时间为60 min时,界面层厚度增加了6％.
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