参考文献
| [1] | CHEN Xingrun,ZHANG Zhifeng,XU Jun.Effects of A-EMS processing parameters on semisolid slurry production[J].稀有金属(英文版),2011(02):195-199. |
| [2] | G. F. Celebi Efe;I. Altinsoy;M. Ipek;S. Zeytin;C. Bindal .Some properties of Cu-SiC composites produced by powder metallurgy method[J].Kovove materialy,2011(2):131-136. |
| [3] | ZHU Guanglei,XU Jun,ZHANG Zhifeng,LIU Guojun.Semisolid microstructure evolution of AZ91D alloy under high shear rate[J].稀有金属（英文版）,2011(01):99-103. |
| [4] | Shu KM.;Tu GC. .The microstructure and the thermal expansion characteristics of Cu/SiCp composites[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2003(1/2):236-247. |
| [5] | Meng H.Investigation on SiCp/Cu composite electronic packaging shell by thixo-forging[M].北京:北京科技大学,2010 |
| [6] | Jianhua Zhu;Lei Liu;Guohua Hu .Study on composite electroforming of Cu/SiC_p Composites[J].Materials Letters,2004(10):1634-1637. |
| [7] | W. Lapkowski .Some studies regarding thixoforming of metal alloys[J].Journal of Materials Processing Technology,1998(0):463-468. |
| [8] | Sundberg G;Paul P;Sung CM;Vasilos T .Fabrication of CuSiC metal matrix composites[J].Journal of Materials Science,2006(2):485-504. |
| [9] | Wang F.Numerical simulation and experiment verification of electronic packaging shell by thixo-forming[M].北京:北京科技大学,2010 |
| [10] | Barmouz, M.;Asadi, P.;Besharati Givi, M.K.;Taherishargh, M. .Investigation of mechanical properties of Cu/SiC composite fabricated by FSP: Effect of SiC particles' size and volume fraction[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2011(3):1740-1749. |
| [11] | HAN Yuanyuan,GUO Hong,YIN Fazhang,ZHANG Ximin,CHU Ke,FAN Yeming.Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles[J].稀有金属（英文版）,2012(01):58-63. |
| [12] | Efe GC;Zeytin S;Bindal C .The effect of SiC particle size on the properties of Cu-SiC composites[J].Materials & Design,2012,36:633. |
| [13] | Nikolopoulos P;Agathopoulos S;Angelopoulos GN;Naoumidis A Grübmeier H .Wettability and interfacial energies in SiC2 liquid metal systems[J].Journal of Materials Science,1992,27:139. |
| [14] | Zhang L;Qu X;Duan B;He X Qin M Ren S .Wettability and pressureless infiltration mechanism in SiC-Cu systems[J].Int J Miner Metal Mater,2009,16(03):327. |
| [15] | Li SS;Wang HL;Liu RY;Fan BB Wang CH Wu YS Zhang R .Effect of different processes on SiC/Cu composites interface bonding[J].Rare Metals Mater Eng,2007,36(01):689. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%