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AIN/Al composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications.The spark plasma sintering(SPS)technique was used for the first time to prepare the AIN/Al composites,and attention was focused on the effects of sintering parameters on the relative density,microstructure and,in particular,thermal conductivity behavior of the composites.The results showed that the relative density and thermal conductivity of the composites increased with increasing sintering temperature and pressure.The composites sintered at 1550℃ for 5 min under 70 Mpa showed the maximum relative density and thermal conductivity,corresponding to 99% and 97.5 W·m-1·K-1,respectively.However,the thermal conductivity of present AIN/Al composites is still far below the theoretical value.Possible reasons for this deviation were discussed.

参考文献

[1] Zweben C .Advanced electronic packaging materials[J].Advanced Materials & Processes,2005,163:33.
[2] ChuK,Jia C.C;Liang X.B;Chen H;Gao W.J .Effect of particle size on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering[J].Rare Metals,2009,28:646.
[3] Zhang Q;Chen G.Q;Wu G.H;Xiu Z.Y, Luan B.F .Property characteristics of a AINp/Al composite fabricated by squeeze casting technology[J].Materials Letters,2003,57:1453.
[4] Naranjo M;Rodriguez J.A;Henera E.J .Sintering of Al/AIN composite powder obtained by gas-solid reaction milling[J].Scripta Materialia,2003,49:65.
[5] Chu K;Jia C.C;Liang X.B .The thermal conductivity of spark plasma sintered SiCp/Al composites containing pores:numerical study and experimental validation[J].Composites Part A:Applied Science and Manufacturing,2010,41:161.
[6] Yang MJ;Zhang DM;Gu XF;Zhang LM .Effects of SiC particle size on CTEs of SiCP/Al composites by pulsed electric current sintering[J].Materials Chemistry and Physics,2006(1):170-173.
[7] Li D.F;Huang J.L;Chang S.T .The mechanical proper-ties of AIN/Al composites manufactured by squeeze casting[J].Journal of the European Ceramic Society,2002,22:253.
[8] Liu Z.Y;Kent D;Schaffer G.B .Powder injection moulding of an Al-AIN metal matrix composite[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,2009,513-514:352.
[9] Zhao M;Wu G.H;Zhu D.Z;Jiang L.T, Dou.Z.Y .Ef-facts of thermal cycling on mechanical properties of AINp/Al composite[J].Materials Letters,2004,58:1899.
[10] Chu K;Wu Q.Y;Jia C.C;Liang X.B,Nie J.H,Tian W.H,Gai G.S, Guo H .Fabrication and thermal conductivity of multi-walled carbon nanotubes reinforced Cu matrix compos-ites for heat sink applications[J].Computer Science and Technology,2010,70:298.
[11] ChuK;Jia C.C;Tian W.H;Liang X.B,Chen H, Guo H .Thermal properties of carbon nanotube-copper composites for thermal management applications[J].Nanoscale Research Letters,2010,5:868.
[12] Hassehnan D.P.H;Donaldson K Y;Geiger A.L .Effect of reinforcement particle size on the thermal conductivity of a particulate silicon carbide-reinforced aluminum-matrix com-posite[J].Journal of the American Ceramic Society,1992,75:3137.
[13] He X.L;Ye F;Zhou Z.Q;Zhang H.J .Thermal conduc-tivity of spark plasma sintered AIN ceramics with multiple components sintering additive[J].Journal of Alloys and Compounds,2010,496:413.
[14] Molina J.M;Rheme M;Canon J .Thermal conductivity of aluminum matrix composites reinforced with mixtures of diamond and SiC particles[J].Scripta Materialia,2008,58:393.
[15] Chu, Ke;Jia, Chengchang;Liang, Xuebing;Chen, Hui;Guo, Hong;Yin, Fazhang;Qu, Xuanhui .Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution[J].Journal of Materials Science,2009(16):4370-4378.
[16] Du X.L;Qin M.L;Sun Y;Yuan Z.H,Yang B.H, Qu X.H .Structure and thermal conductivity of powder injection molded AIN ceramic[J].Advances in Polymer Technology,2010,21:431.
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