CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were investigated.The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process. A new damage type, which is induced by the indentation of embedded abrasives, is found in the subsurface. When a floss pad is used to replace the lapping plate during machining, the surface damage is mainly induced by two-body abrasive and three-body abrasive wear, and the effect of embed-ded abrasives on the surface is greatly weakened. Moreover, this new damage type nearly disappears on the subsurface.
参考文献
[1] | Duff, MC;Hunter, DB;Burger, A;Groza, M;Buliga, V;Black, DR .Effect of surface preparation technique on the radiation detector performance of CdZnTe[J].Applied Surface Science,2008(9):2889-2892. |
[2] | Schlesinger TE.;Yoon H.;Lee EY.;Brunett BA.;Franks L. James RB.;Toney JE. .Cadmium zinc telluride and its use as a nuclear radiation detector material [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2001(4/5):103-189. |
[3] | Badano G;Garland J.W;Sivananthan S .Accuracy of the in situ determination of the CdZnTe temperature by ellip-sometry before the growth of HgCdTe by MBE[J].Journal of Crystal Growth,2003,251(01):571. |
[4] | Zha GQ;He WQ;Li Q;Zeng DM;Yang G;Bai XX;Wang T;Zhang WH;Xu FQ .The study on the surface state of CdZnTe (110) surface[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2006(24):8421-8423. |
[5] | Zha GQ;Jie WQ;Tan TT;Li PS;Zhang WH;Xu FQ .The atomic and electronic structure of CdZnTe (111) A surface[J].Chemical Physics Letters,2006(1-3):197-200. |
[6] | R. SINGH;S. VELICU;J. CROCCO;Y. CHANG;J. ZHAO;L.A. ALMEIDA;J. MARKUNAS;A. KALECZYC;J.H. DINAN .Molecular Beam Epitaxy Growth of High-Quality HgCdTe LWIR Layers on Polished and Repolished CdZnTe Substrates[J].Journal of Electronic Materials,2005(6):885-890. |
[7] | Wang XQ;Jie WQ;Li Q;Gu Z .Surface passivation of CdZnTe wafers[J].Materials science in semiconductor processing,2005(6):615-621. |
[8] | Tao Wang;Wanqi Jie;Jijun Zhang;Ge Yang;Dongmei Zeng;Yadong Xu;Shuying Ma;Hui Hua;Ke He .Study on the behaviors of impurities in cadmium zinc telluride[J].Journal of Crystal Growth,2007(2):313-316. |
[9] | Trezona R.I;Allsopp D.N;Hutchings I.M .Transition between two-body and three-body abrasive wear:influence of the test conditions in the microscale abrasive wear test[J].Wear,1999,205:225. |
[10] | ZHANG Yinxia,KANG Renke,GUO Dongming,JIN Zhuji.Microstructure studies of the grinding damage in monocrystalline silicon wafers[J].稀有金属(英文版),2007(01):13-18. |
[11] | Li S.Y;Wang Z;Wu Y.L .Relationship between sub-surface damage and surface roughness of optical materials in grinding and lapping processes[J].Journal of Materials Processing Technology,2008,205(1-3):34. |
[12] | H. Gao;Y. Huang;W.D. Nix .Mechanism-based strain gradient plasticity- I.Theory[J].Journal of the Mechanics and Physics of Solids,1999(6):0-0. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%