Boundary Layer Distributions and Cooling Rate of Cooling Sloping Plate Process

武汉理工大学学报-材料科学版(英文版), 2013, 28(4): 701-705. doi: 10.1007/s11595-013-0755-9

^1, , ^2, , ^3, , ^4, , ^5, , ^6, , ^7,

1.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

2.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

3.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

4.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

5.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

6.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

7.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

基金项目: the National Natural Science Foundation of China(51034002) the National Natural Science Foundation for Outstanding Young Scholars of China(51222405) the Basic Scientific Research Operation of Center University(N120602002,N120502001) the Chinese National Program for Fundamental Research and Development(2011CB610405) the Fok Ying Tong Education Foundation(132002)

Boundary Layer Distributions and Cooling Rate of Cooling Sloping Plate Process

ZHAO Zhanyong ^1, , GUAN Renguo ^2, , WANG Xiang ^3, , HUANG Hongqian ^4, , CHAO Runze ^5, , DONG Lei ^6, , LIU Chunming ^7,

1.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

2.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

3.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

4.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

5.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

6.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

7.College of Materials and Metallurgy, Northeastern University, Shenyang 110189, China

Keywords： semisolid

参考文献

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