Interfacial Microstructure and Properties of Ti(C,N)/Ni Bonded by Transient Liquid-phase Diffusion

武汉理工大学学报-材料科学版(英文版), 2009, 24(3): 432-439. doi: 10.1007/s11595-009-3432-2

^1, , ^2, , ^3, , ^4,

1.School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;Department of Mechanical Engineering,University of Waterloo,Waterloo,ON,Canada N2L 3G1

2.Department of Mechanical Engineering,University of Waterloo,Waterloo,ON,Canada N2L 3G1

3.School of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China

4.Department of Mechanical Engineering,University of Waterloo,Waterloo,ON,Canada N2L 3G1

基金项目: the National Natural Science Foundation of China(50074017/E0408)

Interfacial Microstructure and Properties of Ti(C,N)/Ni Bonded by Transient Liquid-phase Diffusion

ZHOU Shiquan ^1, , LI Xiaogang ^2, , XIONG Weihao ^3, , ZHOU Yunhong ^4,

1.School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;Department of Mechanical Engineering,University of Waterloo,Waterloo,ON,Canada N2L 3G1

2.Department of Mechanical Engineering,University of Waterloo,Waterloo,ON,Canada N2L 3G1

3.School of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China

4.Department of Mechanical Engineering,University of Waterloo,Waterloo,ON,Canada N2L 3G1

Keywords： vacuum diffusion bonding

Effects of the main process parameters(temperature and time)on microstructure and properties of Ti(C,N)/Ni interface bonded by(Cu+Nb)interlayer in a vacuum diffusion bonding device were investigated.The interfacial microstructures consisted initially of Ni_3Nb metallic compound and eutectic of Ni_3Nb+CuNiSS,and finally transformed to(Ti,Nb)(C,N)+Ni3Nb near Ti(C,N) and NiCuSS+Ni_3Nb near Ni when diffusion bonding temperature was 1 523-1 573 K.It was clear that Cu was a constituent in the transient liquid phase(TLP)into which Ni was dissolved by forming Cu-Ni transition liquid.Nb was dissolved in Cu-Ni transition liquid rapidly.Ti(C,N)conld be wetted by resultant Ni-Nb-Cu transient liquid phase which was followed by a little(Ti,Nb)(C,N)solid solution formed at interface.This increased the interface combining capability.Ultimately the interface shear strength was able to reach 140 MPa.The theoretle analysis and experimental results show that the growth of interfacial reaction layer Ni_3Nb accords with parabola law,and the activation energy of diffusion reaction is 115.0±0.5 kJ/mol,while the diffusion reaction speed constant is 12.53 mm/s~(1/2).

参考文献

[1]	TiC/NiCrMoAlTi金属陶瓷的微观结构与力学性能[J].材料研究学报,2005(04):354-360.
[2]	N.EUSTATHOPOULOS .DYNAMICS OF WETTING IN REACTIVE METAL CERAMIC SYSTEMS[J].Acta materialia,1998(7):0-0.
[3]	周世权,熊惟皓.Ti（C,N）/Ni扩散焊接界面的组织和性能[J].材料研究学报,2007(01):87-91.
[4]	Li Yajiang;Zou Zengda;Holly Xiao .A study on microstructure in the brazing interface of WC-TiC-Co hard alloys[J].International Journal of Refractory Metals & Hard Materials,2002(3):169-173.
[5]	M. Kajihara .Analysis of kinetics of reactive diffusion in a hypothetical binary system[J].Acta materialia,2004(5):1193-1200.
[6]	S. Kundu;S. Chatterjee .Interfacial microstructure and mechanical properties of diffusion-bonded titanium-stainless steel joints using a nickel interlayer[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2006(1/2):107-113.

上一张下一张

计量

下载量()
访问量()

作者相关

在本站搜索
在百度学术搜索
在万方数据库搜索
在CNKI搜索

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%

材料期刊网

Interfacial Microstructure and Properties of Ti(C,N)/Ni Bonded by Transient Liquid-phase Diffusion

参考文献