Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder

武汉理工大学学报-材料科学版(英文版), 2009, (2): 206-209. doi: 10.1007/s11595-009-2206-1

^1, , ^2, , ^3, , ^4,

1.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China

2.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China

3.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China

4.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China

基金项目: the Major Scientific and Technical Project Program of Jiangxi Province(2005008) the Science & Technology Project of Education Department of Jiangxi Province([2007]53 and GJJ09416)

Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder

HUANG Huizhen ^1, , WEI Xiuqin ^2, , LIAO Fuping ^3, , ZHOU Lang ^4,

1.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China

2.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China

3.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China

4.School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China

Keywords： lead-free solder

Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu_5Zn_8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.

参考文献

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