Shear fracture behaviors of Cu/Sn-3Cu/Cu joints with different solder dimensions were investigated. The experimental results demonstrate that, with decreasing ratio R of the solder thickness to length, the interfacial shear strength increased and the fracture mode changed from ductile to a mixture of ductile and brittle. Based on the interfacial stress analysis across the solder joint, a hyperbolic formula expressing the relationship between the interfacial shear strength and the ratio R was proposed. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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