材料期刊网

Polycrystalline Ti2SnC was prepared by a novel solid-liquid reaction synthesis and simultaneous densification method using elemental Ti, Sn and graphite as starting materials. The method is a one-step process and it provides the advantages of simultaneous synthesis and densification. The microstructure evolution during the high temperature processing was described and the reaction route was described. The reaction path for the formation of Ti2SnC can be described in the following steps. Sn melted at 230 degreesC, which provided a favorable liquid circumstance for the reactions between Ti and Sn to form Ti-Sn intermetallic compounds. At high temperatures, TiCx formed and reacted with Ti-Sn intermetallics at similar to1100 degreesC to yield ternary carbide Ti2SnC. The material prepared by this method was dense and showed a layered anisotropic microstructure. The electrical conductivity of polycrystalline Ti2SnC was metallic and anisotropic due to the anisotropic microstructure. The Vickers hardness was 3.7 GPa and the flexural strength was 313 MPa. Under compression, Ti2SnC was damage tolerant at room temperature and deformed plastically at above 1000 degreesC.