材料期刊网

Solder wettability of Sn/FeNi plated on copper coupon after various aging conditions was tested by the wetting balance method to investigate the influence of interfacial intermetallic compound (I-IMC) growth on the solderability of tinned FeNi plating. The wetting force was found to decrease slightly with the growth of a primary FeSn(2) layer at the Sn/FeNi interface. Subsequent growth of a CuNiSn compound layer over FeSn(2) improved wettability, resulting in an increase of the wetting force by 0.035 +/- A 0.005 N/m. The results indicated that the evolution of the solder wettability was related to different I-IMCs sequentially formed at the Sn/FeNi interface.