中国有色金属学报(英文版), 2017, 27(1): 234-240.
10.1016/S1003-6326(17)60027-X
快速凝固对Sn-8Zn-3Bi合金特性及高温时效钎料/铜焊点结构演变的影响
赵国际
1,
,
光华
2,
,
盛光敏
3,
1.重庆大学 材料科学与工程学院,重庆,400044;
2.重庆大学 材料科学与工程学院,重庆,400044;
3.重庆大学 材料科学与工程学院,重庆,400044
研究了快速凝固工艺对Sn?8Zn?3Bi合金显微组织和熔化特性的影响，分析了经150°C高温时效后钎料/铜焊点显微组织演变以评估连接的可靠性。结果表明：经快速凝固后，Sn?8Zn?3Bi 合金中的 Bi 完全固溶于Sn基体并形成枝晶结构；与常规熔铸态合金相比，Bi在Sn基体中的过饱和固溶导致快速凝固态钎料的熔点上升至接近Sn?Zn共晶合金熔点，但同时减小了由于Bi添加对Sn?Zn合金熔化行为产生的不利影响，钎料/铜焊点界面金属间化合物(IMC)层更为致密和均匀；使用快速凝固态钎料能够显著抑制高温时效过程中钎料/铜焊点界面IMC的形成与生长并改善其界面高温稳定性。
参考文献：
[1] Katsuaki Suganuma;Kuen-Soo Kim.Sn-Zn low temperature solder[J].Journal of Materials Science. Materials in Electronics,20071/3(1/3):121-127.
[2] Leonardo R. Garcia;Wislei R. Osorio;Leandro C. Peixoto.Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array[J].Materials Characterization,20102(2):212-220.
[3] Liu, Shuang;Xue, Song-bai;Xue, Peng;Luo, Dong-xue.Present status of Sn-Zn lead-free solders bearing alloying elements[J].Journal of Materials Science. Materials in Electronics,20157(7):4389-4411.
[4] R. Mahmudi;A. R. Geranmayeh;H. Noori;H. Khanbareh;N. Jahangiri.A comparison of impression, indentation and impression-relaxation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders at room temperature[J].Journal of Materials Science. Materials in Electronics,20094(4):312-318.
[5] R. Mahmudi;A.R. Geranmayeh;H. Khanbareh;N. Jahangiri.Indentation Creep Of Lead-free Sn-9zn And Sn-8zn-3bi Solder Alloys[J].Materials & design,20093(3):574-580.
[6] R. Mahmudi;A.R. Geranmayeh;H. Noori.Effect of cooling rate on the room-temperature impression creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,20081/2(1/2):20-25.
[7] Ramani Mayappan;Ahmad Badri Ismail;Zainal Arifin Ahmad.The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20071/2(1/2):112-117.
[8] Jian Zhou;Yangshan Sun;Feng Xue.Properties of low melting point Sn-Zn-Bi solders[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20051/2(1/2):260-264.
[9] Lavernia, E.J.;Srivatsan, T.S..The rapid solidification processing of materials: Science, principles, technology, advances, and applications[J].Journal of Materials Science,20102(2):287-325.
[10] Yanxia Jing;Guangmin Sheng;Guoji Zhao.Influence of rapid solidification on microstructure, thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn-9Zn alloy[J].Materials & design,2013Dec.(Dec.):92-97.
[11] Yanxia Jing;Guangmin Sheng;Zhenhua Huang;Guoji Zhao.Effects of 0.1 wt% Ni addition and rapid solidification process on Sn-9Zn solder[J].Journal of Materials Science. Materials in Electronics,201312(12):4868-4872.
[12] GUOJI ZHAO;GUANGMIN SHENG;JUN LUO;XINJIAN YUAN.Solder Characteristics of a Rapidly Solidified Sn-9Zn-0.1Cr Alloy and Mechanical Properties of Cu/Solder/Cu Joints[J].Journal of Electronic Materials,20128(8):2100-2106.
[13] Guoji Zhao;Guangmin Sheng;Haofei Xue;Xinjian Yuan.Improved mechanical property of a Cu/Sn-9Zn-0.1 Cr/Cu joint using a rapidly solidified solder[J].Materials Letters,2012:129-132.
[14] V. G. Shepelevich;O. V. Gusakova.Structure and Properties of Rapidly Solidified Sn-Zn Foils[J].Inorganic materials,20085(5):485-489.
[15] D.Q.Yu;L.Wang.The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20081/2(1/2):542-547.
[16] Liang Zhang;Song-bai Xue;Li-li Gao;Zhong Sheng;Huan Ye;Zheng-xiang Xiao;Guang Zeng;Yan Chen;Sheng-lin Yu.Development of Sn-Zn lead-free solders bearing alloying elements[J].Journal of Materials Science. Materials in Electronics,20101(1):1-15.
[17] 赵国际;盛光敏;吴莉莉;袁新建.Sn-6.5Zn/Cu焊点时效过程中的界面特征与结构演变[J].中国有色金属学报（英文版）,2012(8):1954-1960.
[18] L.L. Duan;D.Q. Yu;S.Q. Han.Microstructural evolution of Sn-9Zn-3Bi solder/Cu joint during long-term aging at 170 deg C[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,20041/2(1/2):202-207.
材料期刊网