金属学报(英文版), 2016, 29(2): 181-187.
10.1007/s40195-016-0375-4

Kai Wu 1, , Jin-Yu Zhang 1, , Gang Liu 1, , Jiao Li 1, , Guo-Jun Zhang 1, , Jun Sun 2,*,,

1. State Key Laboratory for Mechanical Behavior of Materials,Xi’an Jiaotong University, Xi’an 710049, China;;
2. School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China

An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quantitatively estimate the interfacial energy of the nanostructured multilayer films (NMFs) adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be ~5.0 J/m2 for Cu/Cr, ~4.1 J/m2 for Cu/Ta, ~2.8 J/m2 for Cu/Mo, ~1.1 J/m2 for Cu/Nb, and ~1.2 J/m2 for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models.
引用: Kai Wu, Jin-Yu Zhang, Gang Liu, Jiao Li, Guo-Jun Zhang, Jun Sun . 金属学报(英文版), 2016, 29(2): 181-187. doi: 10.1007/s40195-016-0375-4
参考文献:
[1] O. Kraft, C.A. Volkert, Adv. Eng. Mater. 3, 99 (2001)
[2] J.A. Rogers, T. Someya, Y. Huang, Science 327, 1603 (2010)
[3] D.H. Kim, J.A. Rogers, Adv. Mater. 20, 4887 (2008)
[4] Y. Xiang, T. Li, Z. Suo, J.J. Vlassak, Appl. Phys. Lett. 87,161910 (2005)
[5] T. Li, Z. Suo, Int. J. Solids Struct. 44, 1696 (2007)
[6] A.A. Volinsky, N.R. Moody, W.W. Gerberich, Acta Mater. 50,441 (2002)
[7] N. Lambricht, T. Pardoen, S. Yunus, Acta Mater. 61, 540 (2013)
[8] C.J. Lee, C.H. Hsieh, H.S. Huang, J.C. Huang, Scr. Mater. 69, 5 (2013)
[9] N. Lu, X. Wang, Z. Suo, J. Vlassak, Appl. Phys. Lett. 91,221909 (2007)
[10] M.J. Cordill, F.D. Fischer, F.G. Rammerstorfer, G. Dehm, Acta Mater. 58, 5520 (2010)
[11] M.A. Phillips, B.M. Clemens, W.D. Nix, Acta Mater. 51, 3157 (2003)
[12] A. Misra, J.P. Hirth, R.G. Hoagland, Acta Mater. 53, 4817 (2005)
[13] J. Wang, A. Misra, Curr. Opin. Solid State Mater. Sci. 15, 20 (2011)
[14] J.Y. Zhang, X. Zhang, R.H. Wang, S.Y. Lei, P. Zhang, J.J. Niu,G. Liu, G.J. Zhang, J. Sun, Acta Mater. 59, 7368 (2011)
[15] J.Y. Zhang, S. Lei, J. Niu, Y. Liu, G. Liu, X. Zhang, J. Sun, Acta Mater. 60, 4054 (2012)
[16] J.J. Niu, J.Y. Zhang, G. Liu, P. Zhang, S.Y. Lei, G.J. Zhang, J.Sun, Acta Mater. 60, 3677 (2012)
[17] K. Wu, J.Y. Zhang, J. Li, Y.Q. Wang, G. Liu, J. Sun, Acta Mater. 100, 344 (2015)
[18] N. Jia, M.-W. Zhu, Y.-R. Zheng, T. He, X. Zhao, Acta Metall.Sin. (Engl. Lett.) 28, 600 (2015)
[19] R. Whiting, M.A. Angadi, Meas. Sci. Technol. 2, 879 (1991)
[20] K. Nallamshetty, M.A. Angadi, Phys. Status Solidi A 132, 397(1992)
[21] A. Misra, M.F. Hundley, D. Hristova, H. Kung, T.E. Mitchell,M. Nastasi, J.D. Embury, J. Appl. Phys. 85, 302 (1999)
[22] X. Zhang, A. Misra, J. Appl. Phys. 96, 7173 (2004)
[23] L.B. Freund, S. Suresh, Thin Film Materials: Stress, Defect Formation and Surface Evolution (Cambridge University Press,Cambridge, 2004)
[24] A. Misra, H. Kung, T.E. Mitchell, M. Nastasi, J. Mater. Res. 15,756 (2000)
[25] K. Wu, J.Y. Zhang, G. Liu, P. Zhang, P.M. Cheng, J. Li, G.J.Zhang, J. Sun, Acta Mater. 61, 7889 (2013)
[26] K. Wu, J.Y. Zhang, P. Zhang, Y.Q. Wang, G. Liu, G.J. Zhang, J.Sun, Mater. Sci. Eng. A 613, 130 (2014)
[27] A. Pundt, E. Nikitin, P. Pekarski, R. Kirchheim, Acta Mater. 52,1579 (2004)
[28] H. Jin, W.Y. Lu, M.J. Cordill, K. Schmidegg, Exp. Mech. 51,219 (2011)
[29] Y. Leterrier, Prog. Mater Sci. 48, 1 (2003)
[30] A. Kelly, W.R. Tyson, J. Mech. Phys. Solids 13, 329 (1965)
[31] M.S. Hu, A.G. Evans, Acta Metall. 37, 917 (1989)
[32] Y. Leterrier, L. Boogh, J. Andersons, J.A. Ma°nson, J. Polym.Sci. B 35, 1449 (1997)

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