人工晶体学报, 2017, 46(1): 98-104.
在以5,5'-二甲基已内酰脲(DMH)为配位剂的镀液体系中研究了添加剂 C4H6O2、C7H4NNaO3S 和 C12H25 SO4 Na对金电沉积工艺和电结晶过程的影响。阴极极化曲线测试中,金电沉积的最佳电势区间是-0.60~-1.2 V,添加剂浓度在研究的范围内对阴极极化电势的影响较小。循环伏安曲线结果表明,反应界面上添加剂的吸附能够影响成核生长超电势,对金还原过程表现出抑制作用。电化学阻抗谱研究表明,镀液中加入添加剂后,电荷转移过程变得更加困难。 SEM观察表明,添加剂改善了镀层质量,晶粒变得细致、均匀。 XRD分析证实,两种镀液体系中获得的镀金层都沿着Au(111)和(220)晶面择优生长。
引用：
杨潇薇,
安茂忠
添加剂对DMH体系电沉积金的影响.
人工晶体学报,
2017, 46(1): 98-104.
doi:
参考文献：
[1] J Liu;J L Duam;M E Toimil-Molares.Electrochemical fabrication of single-crystalline and polycrystalline Au nanowires: the influence of deposition parameters[J].Nanotechnology,20068(8):1922-1926.
[2] 费敬银;辛文利;梁国正;朱光明;马晓燕;马宗耀.无氰电刷镀金技术在航天工业中的应用[J].表面技术,2002(5):42-44.
[3] Mirghasem Hosseini;Soheila Ebrahimi.journal of Electroanalytical Chemistry[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,20102(2):109-114.
[4] Wang JW;Wang LP;Di JW;Tu YF.Electrodeposition of gold nanoparticles on indium/tin oxide electrode for fabrication of a disposable hydrogen peroxide biosensor[J].Talanta: The International Journal of Pure and Applied Analytical Chemistry,20094(4):1454-1459.
[5] Yuan Wang;Jiajia Deng;Junwei Di;Yifeng Tu.Electrodeposition of large size gold nanoparticles on indium tin oxide glass and application as refractive index sensor[J].Electrochemistry communications,20095(5):1034-1037.
[6] Zhang, XY;Li, D;Bourgeois, L;Wang, HT;Webley, PA.Direct Electrodeposition of Porous Gold Nanowire Arrays for Biosensing Applications[J].CHEMPHYSCHEM,20092(2):436-441.
[7] Wang, HJ;Zou, CW;Yang, B;Lu, HB;Tian, CX;Yang, HJ;Li, M;Liu, CS;Fu, DJ;Liu, JR.Electrodeposition of tubular-rod structure gold nanowires using nanoporous anodic alumina oxide as template[J].Electrochemistry communications,200910(10):2019-2022.
[8] AMUTHA K;SHAKKTHIVEL P;VASUDEVAN T.在以EDTA和柠檬酸为配位剂的酸性硫代硫酸盐-亚硫酸盐镀液中电沉积金[J].电镀与涂饰,2007(08):1-6.
[9] 肖阳.柠檬酸盐镀金前处理--同性活化工艺在我厂的应用[J].电镀与涂饰,2004(03):47-48.
[10] Rongjun Pan;Yucheng Wu;Kongyong Liew.Investigation of growth mechanism of nano-scaled cadmium sulfide within titanium dioxide nanotubes via solution deposition method[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,201022(22):6564-6568.
[11] Sun W;Ivey DG.Development of an electroplating solution for codepositing Au-Sn alloys[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,19992(2):111-122.
[12] Yang Xiaowei;An Maozhong;Zhang Yunwang;Zhang Lin.Electrochemical behavior of gold (III) in cyanide-free bath with 5,5'-dimethylhydantoin as complexing agent[J].Electrochimica Acta,2011:516-522.
[13] 钟琴 .添加剂MPS、PEG、Clˉ对铜电沉积的影响研究[D].重庆大学,2010.
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